Hybrid conductive structures

Assignee

• TSMC

Inventors

• Cheng-Wei Chang (61 patents)
• Chien-Shun Liao (17 patents)
• Sung-Li Wang (109 patents)
• Shuen-Shin Liang (54 patents)
• Shu-Lan Chang (3 patents)
• Yi-Ying Liu (24 patents)
• Chia-Hung Chu (60 patents)
• Hsu-Kai Chang (30 patents)

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