Expandable thermal solution for laptops

Assignee

• Intel

Inventors

• Jeff Ku (48 patents)
• Tin Poay Chuah (39 patents)
• Howe Yin Loo (21 patents)
• Chin Kung GOH (3 patents)
• Yew San Lim (15 patents)
• Cora Nien (3 patents)

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