Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Three-dimensional (3D) interconnect structures employing via layer conductive structures in via layers and related fabrication methods

Three-dimensional (3D) interconnect structures employing via layer conductive structures in via layers and related fabrication methods

US Patent 12057394 · Granted Aug 6, 2024

Estimated economic value: $15,639,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Child toilet assembly with damping2025
Super pixel architecture for high dynamic range2025
High numerical aperture selective plane illumination microscopy2025
Monolithic three-dimensional (3D) complementary field effect transistor (CFET) c2025
Monolithic three-dimensional (3D) complementary field effect transistor (CFET) c2025
Pulse width modulation and amplitude modulation driving system for display panel2025
Semiconductor structure with a transition layer located between gate and ion imp2025
Pressure washer handle2025
Pb-free perovskite materials for short wave IR devices2025
Transistor cell with self-aligned gate contact2025
Foam cannon for pressure washer2025
Method and system for multi-view episcopic selective plane illumination microsco2025