Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Devices, systems and methods for electrostatic force enhanced semiconductor bonding

Devices, systems and methods for electrostatic force enhanced semiconductor bonding

US Patent 12040211 · Granted Jul 16, 2024

Estimated economic value: $30,823,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems and methods for cooling electrical equipment2024
Plasma doping of gap fill materials2024
Shielded coil assemblies and methods for dry-type transformers2024
Cooling systems and methods using two circuits with water flow in a counter flow2024
Cooling systems and methods using single-phase fluid2024
System and methods utilizing fluid coolers and chillers to perform in-series hea2024
Methods of forming assemblies having heavily doped regions2023
Devices, systems and methods for electrostatic force enhanced semiconductor bond2023
Devices, systems and methods for electrostatic force enhanced semiconductor bond2023
Systems and methods for cooling electrical equipment2023
Plasma doping of gap fill materials2022
System and methods utilizing fluid coolers and chillers to perform in-sertes hea2022