Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming integrated assemblies having transistors configured for high-voltage applications

Method of forming integrated assemblies having transistors configured for high-voltage applications

US Patent 12027621 · Granted Jul 2, 2024

Estimated economic value: $50,597,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated assemblies having transistors configured for high-voltage application2025
Integrated assemblies having transistors configured for high-voltage application2025
Integrated assemblies having transistors configured for high-voltage application2025
Memory devices2025
Stacks of electrically resistive materials and related systems and apparatuses2024
Memory device decoder configurations2023
Memory device decoder configurations2023
Memory device decoder configurations2023
Microelectronic devices, memory devices, and electronic systems2023
Sequential voltage ramp-down of access lines of non-volatile memory device2023
Integrated assemblies having transistors configured for high-voltage application2022
Integrated assemblies having transistors configured for high-voltage application2022