Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Structure for improved mechanical, electrical, and/or thermal performance having solder bumps with different lengths

Structure for improved mechanical, electrical, and/or thermal performance having solder bumps with different lengths

US Patent 12002741 · Granted Jun 4, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device having solder bump structure for improved mechanical, electrical, and/or 2025
Fuel cell membrane humidifier2025
Triple-sided module2025
Content adaptation for streaming2024
Substrate having undercut portion for stress mitigation2024
Substrate having undercut portion for stress mitigation2024
Substrate having undercut portion for stress mitigation2024
Substrate having undercut portion for stress mitigation2024
Sphere projected motion estimation/compensation and mode decision2023
Systems and methods for perspective shifting in video conferencing session2023
Low profile passive components and devices and packages including the same2023
Low profile passive components and devices and packages including the same2023