Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming lead wires in hybrid-bonded semiconductor devices

Method for forming lead wires in hybrid-bonded semiconductor devices

US Patent 11996322 · Granted May 28, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method, electronic device, and system for creating application shortcut2025
Gait planning method, robot and computer-readable storage medium2025
Robot control method, computer-readable storage medium, and robot2025
Display substrate and preparation method therefor, and display device2025
Robot stability control method, robot and computer-readable storage medium2025
Display substrate and display device2025
Staircase structure for memory device2024
Staircase structure for memory device2024
Near-to-eye display device and wearable apparatus2024
Primary optical structure, high-beam lighting device, anti-glare high-beam lamp 2024
Memory cell structure of a three-dimensional memory device2024
Transparent display panel, display device, and glasses2024