Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic package structure, electronic substrate and method of manufacturing electronic package structure

Electronic package structure, electronic substrate and method of manufacturing electronic package structure

US Patent 11978706 · Granted May 7, 2024

Estimated economic value: $9,247,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device, package structure and electronic manufacturing method2025
Electronic structure, electronic package structure and method of manufacturing e2023
Electronic device, package structure and electronic manufacturing method2023
Semiconductor package2023
Semiconductor package2023
Bonding structure and method for manufacturing the same2022
Bonding structure and method for manufacturing the same2022
Semiconductor device package and method of manufacturing the same2022
Semiconductor device package and method of manufacturing the same2022
Semiconductor device packages and methods of manufacturing the same2021
Semiconductor device packages and methods of manufacturing the same2021
Passive element, electronic device and method for manufacturing the same2021