Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device packages and methods of manufacturing the same

Semiconductor device packages and methods of manufacturing the same

US Patent 11120988 · Granted Sep 14, 2021

Estimated economic value: $3,411,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device, package structure and electronic manufacturing method2025
Electronic package structure, electronic substrate and method of manufacturing e2024
Electronic device, package structure and electronic manufacturing method2023
Semiconductor package2023
Bonding structure and method for manufacturing the same2022
Semiconductor device package and method of manufacturing the same2022
Passive element, electronic device and method for manufacturing the same2021
Semiconductor device packages and methods of manufacturing the same2021