Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package having pad with regular and irregular depressions and protrusions and method of manufacturing the same

Semiconductor package having pad with regular and irregular depressions and protrusions and method of manufacturing the same

US Patent 11929315 · Granted Mar 12, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Substrate for solar cell, solar cell, and solar cell manufacturing method2025
Semiconductor package and method of manufacturing the same2025
Semiconductor package including an encapsulant2025
Method of manufacturing semiconductor package, and semiconductor package2025
Semiconductor package2024
Semiconductor package2023
Semiconductor package, electronic apparatus and method of manufacturing the semi2023
Semiconductor package, electronic apparatus and method of manufacturing the semi2022
Shifting lever assembly2018