Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stacked-chip packages having through vias

Stacked-chip packages having through vias

US Patent 11923351 · Granted Mar 5, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package including redistribution substrate2025
Stacked-chip packages2025
Stacked-chip packages2025
Organic photodetector and electronic device including the same2025
Semiconductor package and stacked package module including the same2024
Organic light-emitting diode and method of manufacturing the same2024
Semiconductor package2024
Organic light-emitting diode including a hole injection layer, and method of man2023
Semiconductor package and stacked package module including the same2023
Organic light-emitting device2023
Metal oxide nanoparticle ink composition, method of producing same, and method o2021
Display device and manufacturing method thereof2020