Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Through-silicon via (TSV) fault-tolerant circuit, method for TSV fault-tolerance and integrated circuit (IC)

Through-silicon via (TSV) fault-tolerant circuit, method for TSV fault-tolerance and integrated circuit (IC)

US Patent 11892502 · Granted Feb 6, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor structure2025
Memory structure including elastic material based buffer column structure near c2025
Readout circuit layout structure, readout circuit, and memory layout structure2024
Testing method, testing system, and testing apparatus for semiconductor chip2024
Circuit for testing a memory and test method thereof2024
Word line driving circuit and dynamic random access memory2024
Testing method for packaged chip, testing system for packaged chip, computer dev2024
Word line drive circuit and dynamic random access memory2023
Memory test circuit apparatus and test method2023
Through-silicon via detecting circuit, detecting methods and integrated circuit 2023
Boundary test circuit, memory and boundary test method2022
Fault detection system and method for managing the same2009