Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Land-side silicon capacitor design and semiconductor package using the same

Land-side silicon capacitor design and semiconductor package using the same

US Patent 11887976 · Granted Jan 30, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package structure2025
Semiconductor package structure2025
Semiconductor package structure2025
Electronic device with stacked printed circuit boards2025
Semiconductor package structure2024
Ball pad design for semiconductor packages2024
Semiconductor device2024
Semiconductor package structure2024
Via array design for multi-layer redistribution circuit structure2023
Semiconductor package having discrete antenna device2023
Semiconductor package structure2023
Semiconductor package having discrete antenna device2020