Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stress patterning systems and methods for manufacturing free-form deformations in thin substrates

Stress patterning systems and methods for manufacturing free-form deformations in thin substrates

US Patent 11879170 · Granted Jan 23, 2024

Estimated economic value: $67,430,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus and method for using scanning light beam for film or surface modificat2019
Stress manipulated coating for figure reshape of optical substrates2019
Detection of position, orientation and scale of work pieces using retroreflectiv2018
Apparatus and method for using scanning light beam for film or surface modificat2018
Stress manipulated coating for figure reshape of optical substrates2018
Exposure dose homogenization through rotation, translation, and variable process2017
Method for shaping sheet thermoplastic and the like2011
Hybrid transmission-reflection grating2009
Method and system for interference lithography utilizing phase-locked scanning b2005
Spatial phase locking with shaped electron beam lithography2004
X-ray lithography masking1998
Holographic lithography1992