Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device package and a method of manufacturing the same

Semiconductor device package and a method of manufacturing the same

US Patent 11862525 · Granted Jan 2, 2024

Estimated economic value: $1,190,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Parallel multiplier for saber algorithm2025
Reconfigurable PUF with two PUF functions2025
Semiconductor device with backside power rail2025
Device having a gate electrode wrapping around semiconductor layers and proximat2025
Semiconductor device fabrication methods and structures thereof2025
Semiconductor device and method of fabricating a semiconductor device2025
Semiconductor device having nanosheet transistor and methods of fabrication ther2025
Semiconductor devices2025
Semiconductor devices with backside power rail and methods of fabrication thereo2025
Partial barrier free vias for cobalt-based interconnects and methods of fabricat2025
Method for metal gate cut and structure thereof2025
Integrated circuit including dipole incorporation for threshold voltage tuning i2025