Process for electrically connecting contact surfaces of electronic components

Assignee

• Heraeus Materials Singapore Pte.

Inventors

• Yean Mee Pun (1 patents)
• Murali Sarangapani (8 patents)
• Xi Zhang (9 patents)
• Il Tae Kang (2 patents)
• Abito Danila BAYARAS (1 patents)
• Kim Hui Chong (1 patents)
• Sylvia Sutiono (1 patents)
• Chee Wei Tok (2 patents)
• Tae Yeop Kim (9 patents)

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