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Home › Integrated circuits (ICs) with multi-row columnar die interconnects and IC packages including high density die-to-die (D2D) interconnects

Integrated circuits (ICs) with multi-row columnar die interconnects and IC packages including high density die-to-die (D2D) interconnects

US Patent 11791272 · Granted Oct 17, 2023

Estimated economic value: $7,437,000 ⓘ

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