William M. Aderholdt

QU Qualcomm: 1 patents #7,512 of 12,104Top 65%

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Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
11791272	Integrated circuits (ICs) with multi-row columnar die interconnects and IC packages including high density die-to-die (D2D) interconnects	Rong Zhou	2023-10-17