Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof

Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof

US Patent 11791265 · Granted Oct 17, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Three-dimensional memory devices and fabricating methods thereof2025
Magnetic tunnel junction structures and related methods2025
Embedded MRAM fabrication process for ion beam etching with protection by top el2025
Method and structure for improved memory integrity at array boundaries2025
Embedded pad structures of three-dimensional memory devices and fabrication meth2025
Method and system for providing alternative result for an online search previous2025
Through array contact structure of three-dimensional memory device2024
Methods for forming ferroelectric memory devices2024
Staircase etch control in forming three-dimensional memory device2024
Staircase structure for memory device2024
Staircase structure for memory device2024
Staircase structure for memory device2024