Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Component carrier with through hole filled with extra plating structure between sidewalls and plated bridge structure

Component carrier with through hole filled with extra plating structure between sidewalls and plated bridge structure

US Patent 11778754 · Granted Oct 3, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Component carrier with asymmetric build-up and methods for determining a design 2025
Semi-flex component carrier with dielectric material surrounding an embedded com2024
Semi-flex component carrier with dielectric material having high elongation and 2024
Component carrier with well-defined outline sidewall cut by short laser pulse an2024
Component carrier with low-solvent fiber-free dielectric layer2024
Component carrier having component covered with ultra-thin transition layer2024
User interface for judgment concerning quality classification of displayed array2024
Traceability of subsequent layer structure manufacturing of main body for compon2024
Component carrier with low shrinkage dielectric material2023
Arrangement with central carrier and two opposing layer stacks, component carrie2023
Component carrier with embedded component exposed by blind hole2023
Semi-flexible component carrier with stepped layer structure2023