Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › CMP slurry composition for copper films and method of polishing copper films using the same

CMP slurry composition for copper films and method of polishing copper films using the same

US Patent 11746258 · Granted Sep 5, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Computational storage device and method of operating the same2025
Methods for producing designer esters and assessing alcohol acyltransferase spec2025
Computational storage device, method for operating the computational storage dev2025
Equipment and method for manufacturing separator for fuel cell2025
Method and apparatus for creating virtual world2025
Display device featuring spaced apart insulating layer patterns2025
Light emitting element and display device including the same2024
Sound control device of vehicle and method for controlling the same2024
CMP slurry composition for polishing tungsten pattern wafer and method of polish2024
CMP slurry composition for polishing tungsten pattern wafer and method of polish2024
Therapeutic compounds for red blood cell-mediated delivery of an active pharmace2024
Tape measure having light emitting device2024