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Home › Semiconductor having a backside wafer cavity for radio frequency (RF) passive device integration and/or improved cooling and process of implementing the same

Semiconductor having a backside wafer cavity for radio frequency (RF) passive device integration and/or improved cooling and process of implementing the same

US Patent 11735538 · Granted Aug 22, 2023

Estimated economic value: $39,003,000 ⓘ

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