Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Patterning approach for improved via landing profile

Patterning approach for improved via landing profile

US Patent 11721624 · Granted Aug 8, 2023

Estimated economic value: $7,870,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit with conductive line having line-ends2025
Interconnect structure and methods of forming the same2025
Interconnect line for semiconductor device2025
Interconnect line for semiconductor device2025
Interconnection structure and manufacturing method thereof2025
Integrated circuit2025
Synchronous backlight device and operation method thereof2024
Interconnect structure and methods of forming the same2024
Backlight control method and related display driver circuit for variable refresh2024
Semiconductor device with magnetic tunnel junctions2024
Mitigating pattern collapse2024
Mitigating pattern collapse2024