Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Inkjet printhead having robust encapsulation of wirebonds

Inkjet printhead having robust encapsulation of wirebonds

US Patent 11701883 · Granted Jul 18, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Aerosol extractor for inkjet printing system2025
Aerosol extraction unit with opposite air and suction manifolds2025
Efficient and cost-effective photonic cooler based ir filtering for photovoltaic2025
Compact printing unit with integrated aerosol extraction unit2025
MEMS chip assembly having multiple trenches2024
MEMS chip assembly having multiple trenches2024
Inkjet printhead assembly with wirebond protection2023
Inkjet printhead with sealed shield plate2020
Inkjet printhead with sealed shield plate2020
Inkjet printhead with encapsulant-retaining features2020
Inkjet printhead with encapsulant-retaining features2020
Inkjet printhead with grout retaining features2020