Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12059898 | MEMS chip assembly having multiple trenches | Angus John North, Graeme Lowe, See-Huat Tan, Christopher Barton | 2024-08-13 |
| 11701883 | Inkjet printhead having robust encapsulation of wirebonds | See-Huat Tan, Glenn Horrocks, Mohammad Istiaque Hossain, Michael John Webb, Pascal Blanquer +1 more | 2023-07-18 |
| 10870278 | Inkjet printhead with sealed shield plate | Nicholas Chin, Miao Wang, See-Huat Tan, Jason Mark Thelander, David Burke +2 more | 2020-12-22 |
| 10864733 | Inkjet printhead with encapsulant-retaining features | Angus John North, Graeme Lowe, See-Huat Tan, Christopher Barton | 2020-12-15 |
| 10850517 | Inkjet printhead with grout retaining features | Angus John North, Graeme Lowe, See-Huat Tan, Christopher Barton | 2020-12-01 |
| 8322207 | Tack adhesion testing device | Nadine Lee-Yen Chew | 2012-12-04 |
| 8017450 | Method of forming assymetrical encapsulant bead | Nadine Lee-Yen Chew, Kiangkai Tankongchumruskul | 2011-09-13 |
| 7915091 | Method of controlling satellite drops from an encapsulant jetter | Nadine Lee-Yen Chew, Kiangkai Tankongchumruskul | 2011-03-29 |