Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermal distribution network for semiconductor devices and associated systems and methods

Thermal distribution network for semiconductor devices and associated systems and methods

US Patent 11688662 · Granted Jun 27, 2023

Estimated economic value: $8,383,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of increasing protein yield in mammalian cells in serum-free culture medi2025
Three dimensional semiconductor trace length matching and associated systems and2025
Surface mount device bonded to an inner layer of a multi-layer substrate2025
Split via structure for semiconductor device packaging2025
Split via structure for semiconductor device packaging2025
Microelectronic device packages and related methods and systems2025
Methods and apparatus for using spacer-on-spacer design for solder joint reliabi2025
Apparatus including direct-contact heat paths and methods of manufacturing the s2025
Cross stack bridge bonding devices and associated methods2025
Multi-role semiconductor device substrates, semiconductor device assemblies empl2025
Connection designs for memory systems2025
Semiconductor assemblies with systems and methods for managing high die stack st2025