{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Substrate for radiofrequency applications and associated manufacturing method", "item": "https://www.patentleaderboard.com/patent/11688627"}]}
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Home › Substrate for radiofrequency applications and associated manufacturing method

Substrate for radiofrequency applications and associated manufacturing method

US Patent 11688627 · Granted Jun 27, 2023

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