Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Photosensitive assembly, photographing module, and photosensitive assembly jointed board and corresponding manufacturing method thereof

Photosensitive assembly, photographing module, and photosensitive assembly jointed board and corresponding manufacturing method thereof

US Patent 11646332 · Granted May 9, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Preparation method and use of metal-organic frameworks (MOFs)-based composite pr2025
All-solid-state battery stack2025
Cell reselection method and system, and apparatus2025
Optimal notification2025
Medical hydrogel and preparation method and uses thereof2025
Ultrasonic measurement method for plane stress on the basis of multi-wafer air-c2025
Laminate substrate with embedded multi-layered heat slug2025
Signal angle and signal frequency estimation method, apparatus and device and st2025
Non-terrestrial network communication method and apparatus2025
Communication method and apparatus2025
Method for support structure of large-scale vibrational excitation platform2025
Report transmission method, apparatus, and system2025