Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package substrate

Package substrate

US Patent 11646331 · Granted May 9, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Enforcing security within a data platform2025
Method of fabricating a flip-chip package core substrate with build-up layers2024
Inductance traces protected through shielding layers2024
Image processing system and image processing method2024
Package substrate and method for manufacturing the same2023
Semiconductor package device2023
Semiconductor package device2023
Semiconductor packaging substrate, fabrication method and packaging process ther2022
Electronic device with display interface2022
Flip-chip packaging substrate and method for fabricating the same2022
Model training method and electronic device2022
Semiconductor package substrate having heat dissipating metal sheet on solder pa2022