Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Automatic detection method and automatic detection system for detecting crack on wafer edges

Automatic detection method and automatic detection system for detecting crack on wafer edges

US Patent 11644427 · Granted May 9, 2023

Estimated economic value: $1,331,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

UE access identity determination for 3GPP and non-3GPP accesses2025
Wafer backside defect detection method and wafer backside defect detection appar2023
Wafer backside defect detection method and wafer backside defect detection appar2023
Wafer backside defect detection method and wafer backside defect detection appar2023
Wafer backside defect detection method and wafer backside defect detection appar2023
Wafer backside defect detection method and wafer backside defect detection appar2023
Accelerating an application code portion based on a received configuration2022
Automatic detecting method and automatic detecting apparatus using the same2021
Automatic detecting method and automatic detecting apparatus using the same2021
Three-dimensional printing system2020
Method of monitoring processing system for processing substrate2020
Molybdenum disulfide sensor and method for fabricating the same2018