Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Copper/ceramic bonded body, insulating circuit board, method for producing copper/ceramic bonded body, and method for producing insulating circuit board

Copper/ceramic bonded body, insulating circuit board, method for producing copper/ceramic bonded body, and method for producing insulating circuit board

US Patent 11638350 · Granted Apr 25, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Copper-ceramic bonded body, insulated circuit board, method for producing copper2025
Bonded body, power module substrate, power module, method for manufacturing bond2025
Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded 2024
Copper/ceramic joined body and insulating circuit substrate2024
Insulated circuit board2024
Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded 2024
Bonded body, insulated circuit board with heat sink, and heat sink2024
Bonded body of copper and ceramic, insulating circuit substrate, bonded body of 2024
Copper/ceramic assembly, insulated circuit board, method for producing copper/ce2024
Copper/titanium/aluminum joint, insulating circuit substrate, insulating circuit2024
Copper/ceramic joined body, insulating circuit substrate, copper/ceramic joined 2024
Ceramic/aluminum bonded body, insulating substrate, LED module, ceramic member, 2023