Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Anisotropic conductive film (ACF) for use in testing semiconductor packages

Anisotropic conductive film (ACF) for use in testing semiconductor packages

US Patent 11637045 · Granted Apr 25, 2023

Estimated economic value: $19,274,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit package with glass spacer2024
Dual RDL stacked die package using vertical wire2024
Die over mold stacked semiconductor package2024
Electronic device package2023
System in package with interconnected modules2023
Multi-die, vertical-wire package-in-package apparatus, and methods of making sam2023
Active package substrate having anisotropic conductive layer2023
Temporary interconnect for use in testing a semiconductor package2023
Diode for use in testing semiconductor packages2023
Integrated circuit package with glass spacer2022
Leadframe in packages of integrated circuits2022
Interposer for electrically connecting stacked integrated circuit device package2021