Moisture-curable reactive hot-melt adhesive composition and method for producing the same

Assignee

• Showa Denko Materials Co.

Inventors

• Chika Kuramochi (2 patents)
• Souichirou Komiya (3 patents)
• Kazuyuki Magome (3 patents)
• Kohji Suzumura (1 patents)

View full patent text on Google Patents →