SK

Souichirou Komiya

RE Resonac: 2 patents #101 of 474Top 25%
SC Showa Denko Materials Co.: 1 patents #135 of 270Top 50%
Overall (All Time): #1,320,281 of 4,157,543Top 35%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
12241000 Moisture-curable hot-melt adhesive composition, bonded object, and garment Shujie Qu, Takuya Imai, Kazuyuki Magome, Junichi Kamei 2025-03-04
12043774 Reactive hot-melt adhesive composition, and bonded body and method for producing same Chika Kuramochi, Junichi Kamei 2024-07-23
11624016 Moisture-curable reactive hot-melt adhesive composition and method for producing the same Chika Kuramochi, Kazuyuki Magome, Kohji Suzumura 2023-04-11