Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packaged electronic device and multilevel lead frame coupler

Packaged electronic device and multilevel lead frame coupler

US Patent 11600581 · Granted Mar 7, 2023

Estimated economic value: $30,094,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Back end of line structure for improved current density in HR devices2025
Coupling interfaces for waveguide structures and methods of fabrication2025
Semiconductor device with multiple dies2025
Electronic device and multilevel package substrate with integrated filter2025
Electronic device with patch antenna in packaging substrate2025
Methods and apparatus for power amplifier transformers2025
Microelectronic device package with integral antenna module and semiconductor de2025
Flip-chip enhanced quad flat no-lead electronic device with conductor backed cop2025
Multilayer package substrate with stress buffer2025
Millimeter wave quantum sensor device2025
Millimeter wave quantum sensor device2025
Microelectronic device package including antenna and semiconductor device2025