Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-die interconnect

Multi-die interconnect

US Patent 11594491 · Granted Feb 28, 2023

Estimated economic value: $13,289,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Substrate(s) for an integrated circuit (IC) package employing a metal core for i2025
Chip package with core embedded integrated passive device2025
Package comprising wire bonds coupled to integrated devices2025
Chip package with core embedded integrated devices2025
Chip package with integrated current control2025
Package with a substrate comprising embedded escape interconnects and surface es2025
Integrated circuit (IC) packages employing wire bond channel over package substr2025
Coupled loop and void structure integrated in a redistribution layer of a chip p2025
Package comprising a substrate and a high-density interconnect integrated device2025
Package comprising channel interconnects located between solder interconnects2025
Recess structure for padless stack via2025
Chip package with near-die integrated passive device2024