Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stacked semiconductor die assemblies with partitioned logic and associated systems and methods

Stacked semiconductor die assemblies with partitioned logic and associated systems and methods

US Patent 11562986 · Granted Jan 24, 2023

Estimated economic value: $10,431,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microelectronic devices with vertically recessed channel structures and discrete2025
Virtual privacy creation system2025
Low-loss transmission line structure comprising a dielectric layer stacked with 2025
Memory arrays and methods used in forming a memory array comprising strings of m2025
Generating navigational path based on security level2024
Device, a method used in forming a circuit structure, a method used in forming a2024
Memory arrays and methods used in forming a memory array comprising strings of m2024
True wireless multichannel-speakers device and multiple sound source voicing met2023
Reduced instruction set processor based on memristor2023
Method and apparatus of mapping table reconstruction based on SSD, and computer 2023
Memory arrays and methods used in forming a memory array comprising strings of m2023
Methods of manufacturing stacked semiconductor die assemblies with high efficien2023