Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Testing probe system for testing semiconductor die, multi-channel die having shared pads, and related systems and methods

Testing probe system for testing semiconductor die, multi-channel die having shared pads, and related systems and methods

US Patent 11555828 · Granted Jan 17, 2023

Estimated economic value: $11,545,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device including a clock adjustment circuit2021
Semiconductor device including a clock adjustment circuit2019
Semiconductor device including a clock adjustment circuit2019
Semiconductor device including a clock adjustment circuit2018
Semiconductor device2013
DLL circuit and control method therefor2011
DLL circuit and control method therefor2010
Semiconductor memory device having output impedance adjustment circuit and test 2010
Semiconductor device including DLL circuit, and data processing system2010
Semiconductor integrated circuit device and method of testing the same2010
Duty ratio adjustment2008
Semiconductor device having a test circuit for testing an output circuit2006