Semiconductor composite device and package board used therein

Assignee

• Murata Manufacturing Co.

Inventors

• Koshi HIMEDA (15 patents)
• Tatsuya Kitamura (15 patents)
• Chiharu Sakaki (4 patents)
• Shinya Kiyono (5 patents)
• Sho Fujita (14 patents)
• Atsushi Yamamoto (375 patents)
• Takeshi Furukawa (49 patents)
• Kenji Nishiyama (62 patents)
• Tatsuya Funaki (14 patents)
• Kinya Aoki (2 patents)

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