Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11552020 | Semiconductor composite device and package board used therein | Koshi HIMEDA, Tatsuya Kitamura, Chiharu Sakaki, Sho Fujita, Atsushi Yamamoto +4 more | 2023-01-10 |
| 11121123 | Semiconductor composite device and package board used therein | Koshi HIMEDA, Tatsuya Kitamura, Chiharu Sakaki, Sho Fujita, Atsushi Yamamoto +4 more | 2021-09-14 |
| 10177108 | Method of manufacturing electronic component module and electronic component module | Yoshiaki SATAKE | 2019-01-08 |
| 9860989 | Electronic component module and method for manufacturing electronic component module | Toshitaka HAYASHI, Sho Fujita | 2018-01-02 |
| 9532495 | Method of manufacturing electronic component module and electronic component module | Yoshiaki SATAKE | 2016-12-27 |