Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dense composite material, method for producing the same, joined body, and member for semiconductor manufacturing device

Dense composite material, method for producing the same, joined body, and member for semiconductor manufacturing device

US Patent 11548829 · Granted Jan 10, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Substrate processing apparatus and substrate processing method2025
Stacked structure and semiconductor manufacturing apparatus member2025
Stacked structure and semiconductor manufacturing apparatus member2025
Stacked structure and semiconductor manufacturing apparatus member2025
Composite sintered body, semiconductor manufacturing apparatus member, and metho2024
Composite sintered body, semiconductor manufacturing apparatus member, and metho2024
Substrate processing apparatus and substrate processing method2023
Composite sintered body, semiconductor manufacturing apparatus member, and metho2023
Composite sintered body, semiconductor manufacturing apparatus member, and metho2023
Composite sintered body, semiconductor manufacturing apparatus member, and metho2023
Composite sintered body, semiconductor manufacturing apparatus member and method2023
Composite sintered body, semiconductor manufacturing apparatus member and method2023