Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Assembling and handling edge interconnect packaging system

Assembling and handling edge interconnect packaging system

US Patent 11523511 · Granted Dec 6, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Adiabatic flip-flop and memory cell design2022
Adiabatic flip-flop and memory cell design2022
Edge interconnect self-assembly substrate2022
Edge interconnect self-assembly substrate2022
Edge interconnects for use with circuit boards and integrated circuits2022
Edge interconnects for use with circuit boards and integrated circuits2022
Assembling and handling edge interconnect packaging system2021
Assembling and handling edge interconnect packaging system2021
Edge interconnect self-assembly substrate2021
Edge interconnect self-assembly substrate2021
Method and system to passively align and attach fiber array to laser array or op2020
Method and system to passively align and attach fiber array to laser array or op2020