Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device structure having stiffener with two or more contact points for heat dissipating element

Semiconductor device structure having stiffener with two or more contact points for heat dissipating element

US Patent 11521939 · Granted Dec 6, 2022

Estimated economic value: $2,468,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Beam2025
Outdoor electronic device2024
Systems and methods for suction pad assemblies2024
Systems and methods for suction pad assemblies2022
Package structure and method for manufacturing the same2022
Method and apparatus for orchestrating resources in multi-access edge computing 2021
Method for determining toxic substances by plant gel agar coagulation2019
Chemical mechanical polishing system2019
Semiconductor device and method for manufacturing the same2019
Semiconductor device and method for manufacturing the same2019
Cloud video system2017
Video conferencing system and multi-way video conference switching method2016