Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521939 | Semiconductor device structure having stiffener with two or more contact points for heat dissipating element | Yu-Hsing Lin, Chia-Chieh Hu, Chun-Cheng Kuo, Yu-Hsiang CHAO | 2022-12-06 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521939 | Semiconductor device structure having stiffener with two or more contact points for heat dissipating element | Yu-Hsing Lin, Chia-Chieh Hu, Chun-Cheng Kuo, Yu-Hsiang CHAO | 2022-12-06 |