Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate processing method using multiline patterning

Substrate processing method using multiline patterning

US Patent 11515160 · Granted Nov 29, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Metal oxide resists for EUV patterning and methods for developing the same2025
Cyclic method for reactive development of photoresists2025
Oblique deposition and etch processes2025
Method for pitch split patterning using sidewall image transfer2023
Method and system for capping of cores for self-aligned multiple patterning2023
Surface fluorination remediation for aluminium oxide electrostatic chucks2023
Methods to reduce microbridge defects in EUV patterning for microelectronic work2023
Methods for EUV inverse patterning in processing of microelectronic workpieces2023
Methods to reshape spacer profiles in self-aligned multiple patterning2023
Method of line roughness improvement by plasma selective deposition2022
Forming a semiconductor feature using atomic layer etch2022
Multiple patterning processes2022