Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same

Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same

US Patent 11456271 · Granted Sep 27, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Palladium-coated copper bonding wire, manufacturing method of palladium-coated c2025
Palladium-coated copper bonding wire and method for manufacturing same2024
Palladium-coated copper bonding wire, wire bonding structure, semiconductor devi2024
Method for producing 1,2-dichloro-3,3-difluoro-1-propene and solvent composition2023
Method for producing 1,2-dichloro-3,3-difluoro-1-propene and solvent composition2022
Gold-coated silver bonding wire and manufacturing method thereof, and semiconduc2022
Gold-coated silver bonding wire and manufacturing method thereof, and semiconduc2022
Noble metal-coated silver wire for ball bonding, and semiconductor device using 2022
Noble metal-coated silver wire for ball bonding, and semiconductor device using 2022
Noble metal-coated silver wire for ball bonding, and semiconductor device using 2022
Palladium (Pd)-coated copper wire for ball bonding2019
Bonding wire for high-speed signal line2018