Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Circuit board having heat-dissipation block and method of manufacturing the same

Circuit board having heat-dissipation block and method of manufacturing the same

US Patent 11445596 · Granted Sep 13, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ultra-low heavy-duty active suspension, suspension vehicle and leveling control 2025
Multi-layered resonator circuit structure and multi-layered filter circuit struc2025
Circuit board structure2025
Circuit board2024
Circuit board structure and manufacturing method thereof2024
Metal bump structure and manufacturing method thereof and driving substrate2023
Circuit board structure2023
Circuit board and manufacturing method thereof2023
Package substrate and manufacturing method having a mesh gas-permeable structure2022
Package substrate and manufacturing method having a mesh gas-permeable structure2022
Package carrier and package structure2020
Chip module with porous bonding layer and stacked structure with porous bonding 2020