Inter-poly connection for parasitic capacitor and die size improvement

Assignee

• TSMC

Inventors

• Shyh-Wei Cheng (21 patents)
• Chih-Yu Wang (35 patents)
• Hsi-Cheng Hsu (31 patents)
• Ji-Hong Chiang (20 patents)
• Jui-Chun Weng (36 patents)
• Shiuan-Jeng Lin (24 patents)
• Wei-Ding Wu (20 patents)
• Ching-Hsiang Hu (16 patents)

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