Dielectric material change to optimize electrical and mechanical properties of flex circuit

Assignee

• IBM

Inventors

• John R. Dangler (124 patents)
• Arthur J. Higby (20 patents)
• Philipp K Buchling Rego (6 patents)
• David C. Long (167 patents)
• James A. Busby (62 patents)
• Matthew S. Doyle (24 patents)
• Edward N. Cohen (17 patents)
• Michael J. Fisher (66 patents)
• William Santiago-Fernandez (44 patents)

View full patent text on Google Patents →