Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for measuring wafer movement and placement using vibration data

Method and apparatus for measuring wafer movement and placement using vibration data

US Patent 11342210 · Granted May 24, 2022

Estimated economic value: $75,273,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and systems of optical inspection of electronic device manufacturing mac2025
Method and apparatus for measuring erosion and calibrating position for a moving2024
Method and apparatus for measuring placement of a substrate on a heater pedestal2024
Method and apparatus for measuring erosion and calibrating position for a moving2022
Method and apparatus for measuring placement of a substrate on a heater pedestal2022
Method and apparatus for measuring process kit centering2022
Method and apparatus for direct measurement of chucking force on an electrostati2021
Method and apparatus for measuring process kit centering2020
Long range capacitive gap measurement in a wafer form sensor system2020
Method and apparatus for determining substrate placement in a process chamber2019